Added Value Technology is your quick-turn source for Enthone's Entek® Plus HT process. This
process will selectively coat copper pads and through-holes with a durable film that maintains surface
planarity and solderability even when subjected to multiple eutechtic or lead-free SMT thermal reflow cycles.
ENTEK® PLUS HT OSP enables high reliability and consistently high solderjoint strength during electronic assembly.
- Fast processing time
- Superior Solderability
- More reflow cycles than most other OSP processes (up to 9 reflows)
- RoHS compliant
- Standard Thickness: 0.2 to 0.6 microns (8 to 24 microinches)
- Standard Panel Size: Maximum panel size is 18" x 24". Routed parts and other panel sizes smaller may
be processed. Please call for details.
- Flex and Rigid Capabilities
- Same day processing